@conference{aufsatz20464,
    affiliation = {Professur für Halbleitertechnik},
    title = {Fabrication of Surface Acoustic Wave Structures with buried Copper IDTs using the Copper Damascene Process},
    journal = {Tag.-Bd. Int. Conf. Planarization/CMP Technology (ICPT)},
    pages = {479--485},
    publisher = {VDE Verlag},
    year = {2007},
    peerreview = {Nein},
    doi = {http://},
    author = {S., Menzel and D., Reitz and U., Künzelmann and M., Albert and J.W., Bartha}
}