@conference{aufsatz20467,
    affiliation = {Professur für Halbleitertechnik},
    title = {Application of the Copper Damascene Process for the Preparation of Electromigration Test Structures},
    journal = {Int. Conf. Planarization/CMP Technology (ICPT)},
    pages = {331--336},
    publisher = {VDE Verlag},
    year = {2007},
    peerreview = {Nein},
    doi = {http://},
    author = {M., Stangl and J., Acker and V. , Hoffmann and V. , Wetzig and U., Künzelmann and J.W., Bartha}
}