@conference{aufsatz20711,
    affiliation = {Professur für Halbleitertechnik},
    title = {Creation of Vias with Optimized Profile for 3-D Through Silicon Interconnects (TSV)},
    journal = {Posterbeitrag, 11th Int. Conf. on PSE 2008, 15.-19.9.2008, Garmisch-Partenkirchen },
    year = {2008},
    peerreview = {Nein},
    volume = {Proceedings PSE 2008 },
    doi = {http://},
    author = {Richter, K. and Viehweger, K. and He, J. and Bartha, J.W.}
}