@conference{aufsatz23658,
    affiliation = {Professur für Halbleitertechnik},
    title = {Cu alloy and Cu bilayer adhesion studies on PEALD Ta-C-N using Al, Ag, Ru and Ta},
    journal = {Proc. of Advanced Metallization Conference (AMC 2008), San Diego, CA, September 2008},
    year = {2008},
    peerreview = {Ja},
    doi = {http://},
    author = {H., Wojcik and S., Strehle and M., Knaut and R., Kaltofen and T.M., Pletea and J., He and U., Merkel and C., Wenzel and J.W., Bartha and A., Preusse}
}