@conference{aufsatz23659,
    affiliation = {Professur für Halbleitertechnik},
    title = {A Comparative study of thermal and plasma enhanced ALD Ta-N-C films on SiO(sub 2), SiCOH and Cu substrates},
    journal = {10th International Interconnect Technology Conference, Burlingame, CA, 3-6 June 2007},
    pages = {17--19},
    location = {USA},
    year = {2007},
    peerreview = {Ja},
    volume = {IEEE 2007/ISBN 1-4244-1069-X},
    doi = {http://},
    author = {Wojcik, H. and Friedemann, M. and Feustelt, F. and Albert, M. and Ohsiekt, S. and Metzgert, J. and Voss, J. and Bartha, J.W. and Wenzel, C.}
}