@conference{aufsatz23681,
    affiliation = {Professur für Halbleitertechnik},
    title = {Preparation and Investigation of Thin Coated Au and Cu Wires for US Wedge Wedge Bonding at Room Temperature},
    journal = {Semiconductor Conference Dresden, 23.-24.04.08},
    year = {2008},
    peerreview = {Ja},
    volume = {CD},
    doi = {http://},
    author = {Nobis, C. and Klaus, C. and Hiemann, H. and Rudolf, F. and Wenzel, C. and Bartha, J.W.}
}