@conference{aufsatz23745,
affiliation = {Professur für Halbleitertechnik},
title = {Electrochemical Cu Deposition in sub-100-nm Interconnects - Results for a new Model},
journal = {Advanced Metallization Conference, Sept. 22-24, San Diego, USA},
year = {2008},
peerreview = {Ja},
doi = {http://},
author = {Liske, R. and Preusse, A. and Wehner, S. and Kuecher, P. and Bartha, J.W.}
}