@conference{aufsatz23754,
    affiliation = {Professur für Halbleitertechnik},
    title = {Preparation of coated Au and Cu wires for US and investigation on their impact on the US wedge bond process},
    journal = {Smart Systems Integration, 10.-11.03.2009, Brüssel},
    publisher = {AKA-Verlag},
    isbn = {978-3-89838-616-6},
    year = {2009},
    peerreview = {Nein},
    volume = {Paper},
    doi = {http://},
    author = {Nobis, C. and Klaus, C. and Hiemann, H. and Wenzel, C. and Bartha, J.W. and Rudolf, F.}
}