@article{aufsatz26499,
affiliation = {Professur für Halbleitertechnik},
title = {Electromigration in electroplated Cu(Ag) alloy thin films investigated by means of single damascene Blech structures},
journal = {Microelectronic Engineering},
keywords = {Single damascene technology, Electromigration drift experiments, Blech structures, Copper-silver alloys},
year = {2009},
peerreview = {Ja},
volume = {in press},
doi = {10.1016/j.mee.2009.04.028},
author = {Strehle, S. and Menzel, S. and Jahn, A. and Merkel, U. and Bartha, J.W. and Wetzig, K.}
}