@article{aufsatz32256,
    affiliation = {Professur für Halbleitertechnik},
    title = {Microstructure in copper interconnects - Influence of plating additive concentration},
    journal = {Microelectronic Engineering},
    keywords = {Copper, Electrochemical deposition, Additive concentration, Self-annealing, Grain growth},
    pages = {254--257},
    year = {2010},
    peerreview = {Ja},
    volume = {87},
    doi = {10.1016/j.mee.2009.07.019},
    author = {Neuner, J. and Zienert, I. and Peeva, A. and Preusse, A. and Kücher, P. and Bartha, J.W.}
}