@article{aufsatz32259,
affiliation = {Professur für Halbleitertechnik},
title = {Electroplating of Cu(Ag) thin films for interconnect applications},
journal = {Microelectronic Engineering},
keywords = {Electrochemical deposition, Copper-silver alloy thin film, Interconnect material},
pages = {180--186},
year = {2010},
peerreview = {Ja},
volume = {87},
doi = {10.1016/j.mee.2009.07.010},
author = {Strehle, S. and Menzel, S. and Bartha, J.W. and Wetzig, K.}
}