BibTex - Publikationen
@article{aufsatz32259,
    affiliation = {Professur für Halbleitertechnik},
    title = {Electroplating of Cu(Ag) thin films for interconnect applications},
    journal = {Microelectronic Engineering},
    keywords = {Electrochemical deposition, Copper-silver alloy thin film, Interconnect material},
    pages = {180--186},
    year = {2010},
    peerreview = {Ja},
    volume = {87},
    doi = {10.1016/j.mee.2009.07.010},
    author = {Strehle, S. and Menzel, S. and Bartha, J.W. and Wetzig, K.}
}