@article{aufsatz32262,
    affiliation = {Professur für Halbleitertechnik},
    title = {Creation of Vias With optimized Profile for 3-D Through Silicon Interconnects (TSV)},
    journal = {Plasma Process. Polym.},
    keywords = {Trough Silicon Interconnects},
    pages = {193--197},
    year = {2009},
    peerreview = {Ja},
    volume = {6},
    doi = {10.102/ppap.200930501},
    author = {Richter, K. and Viehweger, K. and He, J. and Bartha, J.W.}
}