@conference{aufsatz38178,
    affiliation = {Professur für Halbleitertechnik},
    title = {Investigations on Ru-Mn films as plateable Cu diffusion barriers},
    journal = {In: Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International, 2011},
    keywords = {-},
    pages = {1--3},
    year = {2011},
    peerreview = {Nein},
    openaccess = {Nein},
    author = {Wojcik, H. and Kaltofen, R. and Krien, C. and Merkel, U. and Wenzel, C. and Bartha, J.W. and Friedemann, M. and Adolphi, B. and Liske, R. and Neumann, V. and Geidel, M.}
}