@misc{aufsatz38179,
    affiliation = {Professur für Halbleitertechnik},
    title = {Electrical Evaluation of Ru–W(-N), Ru–Ta(-N) and Ru–Mn films as Cu diffusion barriers},
    journal = {Microelectronic Engineering, Available online 27 May 2011},
    keywords = {-},
    issn = {0167-9317},
    year = {2011},
    peerreview = {Ja},
    openaccess = {Nein},
    doi = {10.1016/j.mee.2011.03.165, http://www.sciencedirect.com/science/article/pii/S0167931711004837},
    author = {Wojcik, H. and Kaltofen, R. and Merkel, U. and Krien, C. and Strehle, S. and Gluch, J. and Knaut, M. and Wenzel, C. and Preusse, A. and Bartha, J.W. and Geidel, M. and Adolphi, B. and Neumann, V. and Liske, R. and Munnik, F.}
}