@article{aufsatz38180,
affiliation = {Professur für Halbleitertechnik},
title = {Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements},
journal = {Microelectronic Engineering},
keywords = {-},
pages = {641--645},
issn = {0167-9317},
year = {2011},
peerreview = {Ja},
openaccess = {Nein},
volume = {88},
number = {5},
doi = {10.1016/j.mee.2010.06.034, http://www.sciencedirect.com/science/article/pii/S0167931710002200},
author = {Wojcik, H. and Merkel, U. and Jahn, A. and Richter, K. and Junige, M. and Klein, C. and Gluch, J. and Albert, M. and Munnik, F. and Wenzel, C. and Bartha, J.W.}
}