@conference{aufsatz38189,
    affiliation = {Professur für Halbleitertechnik},
    title = {Characterization of barrier and seed layer integrity for copper interconnects},
    journal = {Semiconductor Conference Dresden (SCD), 27-28 Sept. 2011},
    keywords = {-},
    isbn = {978-1-4577-0431-4},
    year = {2011},
    peerreview = {Nein},
    openaccess = {Nein},
    doi = {Digital Object Identifier: 10.1109/SCD.2011.6068735},
    author = {Wojcik, H. and Lehninger, D. and Neumann, V. and Bartha, J.W.}
}