@article{aufsatz43715,
affiliation = {Professur für Halbleitertechnik},
title = {Greenwood-Williamson Model Combining Pattern-Density and Pattern-Size Effects in CMP},
journal = {IEEE Transactions on Semiconductor Manufacturing},
keywords = {CMP, Greenwood-Williamson, pad roughness},
pages = {338--347},
year = {2011},
peerreview = {Ja},
openaccess = {Nein},
volume = {24},
number = {2},
author = {Vasilev, B. and Rzehak, R. and Bott, S. and Kücher, P. and Bartha, J.W.}
}