@conference{aufsatz43786,
    affiliation = {Professur für Halbleitertechnik},
    title = {Atomic layer deposition for high aspect ratio through silicon vias},
    journal = {Materials for Advanced Metallization 2012, Grenoble, France},
    keywords = {ALD, TSV, high aspect ratio, Al2O3, TaN, Ru, Cu, ECD, process integration},
    year = {2012},
    peerreview = {Nein},
    openaccess = {Nein},
    author = {Knaut, M. and Junige, M. and Wojcik, H. and Neumann, V. and Hiess, A. and Henke, T. and Albert, M. and Bartha, J.W. and Hoßbach, C.}
}