@article{aufsatz43787,
    affiliation = {Professur für Halbleitertechnik},
    title = {Electrical Evaluation of Ru-W(-N), Ru-Ta(-N) and Ru-Mn films as Cu diffusion barriers},
    journal = {Microelectronic Engineering, 27th Annual Advanced Metallization Conference 2010},
    keywords = {Cu diffusion barrier, Ru composites, Bias temperature stress, Triangular voltage sweep},
    pages = {71--75},
    year = {2012},
    peerreview = {Ja},
    openaccess = {Nein},
    volume = {92},
    doi = {doi:10.1016/j.mee.2011.03.165},
    author = {Wojcik, H. and Kaltofen, R. and Merkel, U. and Krien, C. and Strehle, S. and Gluch, J. and Knaut, M. and Wenzel, C. and Preusse, A. and Bartha, J.W. and Geidel, M. and Adolphi, B. and Neumann, V. and Liske, R. and Munnik, F.}
}