@article{aufsatz49926,
    affiliation = {Professur für Halbleitertechnik},
    title = {Atomic layer deposition for high aspect ratio through silicon vias},
    journal = {Microelectronic Engineering},
    keywords = {TSV, ALD, ECD, high-aspect ratio, interconnects, 3D},
    pages = {80--83},
    year = {2013},
    peerreview = {Ja},
    openaccess = {Ja},
    volume = {107},
    doi = {doi:10.1016/j.mee.2013.01.031},
    author = {Knaut, M. and Junige, M. and Neumann, V. and Wojcik, H. and Henke, T. and Hossbach, C. and Hiess, A. and Albert, M. and Bartha, J.W.}
}