@conference{aufsatz56660,
    affiliation = {Professur für Optoelektronische Bauelemente und Systeme},
    title = {Wafer level vacuum packaging of scanning micro-mirrors using glass-frit and anodic bonding methods},
    journal = {Proc. SPIE 8614 (2013)},
    keywords = {Optoelectronics wafer bonding methods},
    publisher = { },
    location = {San Francisco, CA, USA},
    year = {2013},
    peerreview = {Ja},
    openaccess = {Nein},
    volume = {Reliability, Packaging, Testing and Characterization of MOEMS/MEMS and Nanodevices XII, Photonics West, February 4-5 2013 },
    doi = {DOI:10.1117/12.2003525},
    author = {Langa, S. and Drabe, C. and Kunath, C. and Dreyhaupt, A. and Schenk, H.}
}