@conference{aufsatz57142,
    affiliation = {Professur für Halbleitertechnik},
    title = {Cu barrier properties of very thin Ta and TaN films },
    journal = {Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International, 20-23 May 2014, San Jose, CA },
    keywords = {Cu diffusion barrier, bias temperature stress, tantalum, TaN, triangular voltage swepp},
    pages = {167--170},
    isbn = {9781479950164 },
    year = {2014},
    peerreview = {Ja},
    openaccess = {Nein},
    doi = {http://dx.doi.org/10.1109/IITC.2014.6831854},
    author = {Woijcik, H. and Schwiegel, B. and Klaus, C. and Urbansky, N. and Kriz, J. and Hahn, J. and Kubasch, C. and Wenzel, C. and Bartha, J. W.}
}