@article{aufsatz57408,
    affiliation = {Professur für Halbleitertechnik},
    title = {Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP},
    journal = {Microelectronic Engineering},
    keywords = {Chemical–mechanical planarization, CMP, Pad roughness, Asperities radius of curvature, Break-in},
    pages = {21--28},
    year = {2013},
    peerreview = {Ja},
    openaccess = {Nein},
    volume = {111},
    doi = {doi:10.1016/j.mee.2013.04.027},
    author = {Vasilev, B. and Bott, S. and Rzehak, R. and Bartha, J. W.}
}