BibTex - Publikationen
@article{aufsatz57410,
    affiliation = {Professur für Halbleitertechnik},
    title = {Enhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films in Cu/low-k interconnects},
    journal = {Microelectronic Engineering},
    keywords = {ALD TaN, Cu diffusion barrier, Triangular voltage sweep, Plasma treatment, Low-k},
    pages = {29--34},
    year = {2013},
    peerreview = {Ja},
    openaccess = {Nein},
    volume = {110},
    doi = {doi:10.1016/j.mee.2013.03.176},
    author = {Woijcik, H. and Hossbach, C. and Kubasch, C. and Verdonck, P. and Barbarin, Y. and Merkel, U. and Bartha, J. W. and Hübner, R. and Engelmann, H.-J. and Friedemann, M.}
}