@article{aufsatz57410,
affiliation = {Professur für Halbleitertechnik},
title = {Enhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films in Cu/low-k interconnects},
journal = {Microelectronic Engineering},
keywords = {ALD TaN, Cu diffusion barrier, Triangular voltage sweep, Plasma treatment, Low-k},
pages = {29--34},
year = {2013},
peerreview = {Ja},
openaccess = {Nein},
volume = {110},
doi = {doi:10.1016/j.mee.2013.03.176},
author = {Woijcik, H. and Hossbach, C. and Kubasch, C. and Verdonck, P. and Barbarin, Y. and Merkel, U. and Bartha, J. W. and Hübner, R. and Engelmann, H.-J. and Friedemann, M.}
}