@article{aufsatz57423,
    affiliation = {Professur für Halbleitertechnik},
    title = {A method for characterizing the pad surface texture and modeling its impact on the planarization in CMP},
    journal = {Microelectronic Engineering},
    keywords = {Chemical-mechanical planarization, CMP, Pad roughness, Asperities radius of curvature distribution, Greenwood and Williamson theory, Modeling},
    pages = {48--57},
    year = {2013},
    peerreview = {Ja},
    openaccess = {Ja},
    volume = {104},
    doi = {doi:10.1016/j.mee.2012.10.007},
    author = {Vasilev, B. and Bott, S. and Rzehak, R. and Liske, R. and Bartha, J. W.}
}