@article{aufsatz6087,
    affiliation = {Professur für Halbleitertechnik},
    title = {Void formation in the Cu layer during thermal treatment of SiNx/Cu/Ta73Si27/SiO2/Si systems},
    journal = {Cryst. Res. Technol. 40, No. 1/2},
    pages = {135--142},
    year = {2005},
    peerreview = {Nein},
    author = {Hübner, R. and Reiche, R. and Hecker, M. and Mattern, N. and Hoffmann, V. and Wetzig, K. and Heuer, H. and Wenzel, C. and Engelmann, H.-J.}
}