@article{aufsatz6113,
    affiliation = {Professur für Halbleitertechnik},
    title = {Effect of nitrogen content on the degradation mechanisms of thin Ta–Si–N diffusion barriers for Cu metallization},
    journal = {Thin Solid Films 497 (2006) in press},
    year = {2005},
    peerreview = {Nein},
    edition = {Neuerscheinung},
    author = {Hübner, R. and Hecker, M. and Mattern, N. and Hoffmann, V. and Wetzig, K. and Heuer, H. and Wenzel, C. and Engelmann, H.-J. and Gehre, D. and Zschech, E.}
}