@conference{aufsatz6119,
    affiliation = {Professur für Halbleitertechnik},
    title = {Degradation mechanism of thin Ta-Si-N diffusion barriers for Cu interconnects},
    journal = {Proceedings ICMAT 2005, 3.-8. Juli , Singapore},
    year = {2005},
    peerreview = {Nein},
    author = {Hübner, R. and Hecker, M. and Mattern, N. and Hoffmann, V. and Wetzig, K. and Heuer, H. and Wenzel, C. and Engelmann, H.j. and Zschech, E.}
}