@conference{aufsatz6124,
    affiliation = {Professur für Halbleitertechnik},
    title = {Thermal behavior of graded Ta-Si / Ta-Si-N diffusion barriers for Cu interconnects},
    journal = {Proceed. Stress Workshop and 8th International Workshop on Stress-Induced Phenomena in Metallization 2005 Dresden, September 12–14, 2005},
    year = {2005},
    peerreview = {Nein},
    edition = {Neuerscheinung},
    author = {Hübner, R. and Hoffmann, V. and Wetzig, K. and Heuer, H. and Wenzel, C. and Engelmann, H.-J. and Hecker, M. and Zschech, E.}
}