@conference{aufsatz6132,
    affiliation = {Professur für Halbleitertechnik},
    title = {High Density ALD Titanium Nitride (TiN) layer etch using Argon/NF3/Cl2 Mixtures Utilizing a Remote Plasma Source (RPS) for ALD/CVD Chamber Clean Application},
    journal = {AVS 5th International Conference on Atomic Layer Deposition, San Jose, 8.-10.08.2005},
    year = {2005},
    peerreview = {Nein},
    edition = {Neuerscheinung},
    author = {Hellriegel, R. and Hintze, B. and Winzig, H. and Albert, M. and Bartha, J. W.}
}