@inbook{aufsatz71515,
    affiliation = {Professur für Halbleitertechnik},
    title = {Optical Through-Silicon Vias},
    journal = {3D Stacked Chips - From Emerging Processes to Heterogeneous Systems, I.M. Elfadel, G. Fettweis (eds.)},
    keywords = {-},
    pages = {221--234},
    publisher = {Springer, Part II, Chapter 12 Switzerland 2016},
    isbn = {978-3-319-20480-2},
    year = {2016},
    peerreview = {Ja},
    openaccess = {Nein},
    doi = {10.1007/978-3-319-20481-9_12},
    author = {Killge, S. and Neumann, N. and Plettemeier, D. and Bartha, J.W.}
}