@inbook{aufsatz71552,
    affiliation = {Professur für Halbleitertechnik},
    title = {Copper-Based TSV: Interposer},
    journal = {3D Stacked Chips - From Emerging Processes to Heterogeneous Systems, I.M. Elfadel, G. Fettweis (eds.)},
    keywords = {-},
    pages = {9--28},
    publisher = {Springer Verlag, Part I Switzerland 2016},
    isbn = {978-3-319-20480-2},
    year = {2016},
    peerreview = {Ja},
    openaccess = {Nein},
    doi = {10.1007/978-3-319-20481-9_2},
    author = {Killge, S. and Neumann, V. and Bartha, J.W.}
}