@inbook{aufsatz71555,
    affiliation = {Professur für Halbleitertechnik},
    title = {Introduction to Electrical 3D Integration},
    journal = {3D Stacked Chips - From Emerging Processes to Heterogeneous Systems, I.M. Elfadel, G. Fettweis (eds.)},
    keywords = {-},
    pages = {3--7},
    publisher = {Springer International Publishing Switzerland 2016},
    isbn = { 978-3-319-20480-2},
    year = {2016},
    peerreview = {Ja},
    openaccess = {Nein},
    doi = {10.1007/978-3-319-20481-9_1},
    author = {Killge, S. and Charania, S. and Bartha, J.W.}
}