@conference{aufsatz74467,
    affiliation = {Professur für Halbleitertechnik},
    title = {3D system integration on 300 mm wafer level : high-aspect-ratio TSVs with ruthenium seed layer by thermal ald and subsequent copper electroplating},
    journal = {Materials for Advanced Metallization : March 26-29, 2017, Dresden, Germany. Dresden, 2017},
    keywords = {-},
    year = {2017},
    peerreview = {Ja},
    openaccess = {Nein},
    author = {Killge, S. and Bartussek, I. and Junige, M. and Neumann, V. and Wenzel, C. and Böttcher, M. and Albert, M. and Wolf, M.J. and Bartha, J.W.}
}