@article{aufsatz80880,
affiliation = {Professur für Mikrosystemtechnik},
title = {Characterization of self-assembled monolayers for CueCu bonding technology},
journal = {Microelectronic Engineering 202 },
keywords = {Self-assembled monolayer, XPS, Infrared spectroscopic ellipsometry, IRSE, Cu-Cu bonding, Cu passivation},
pages = {19--24},
location = {www.elsevier.com/locate/mee},
year = {2018},
peerreview = {Ja},
openaccess = {Nein},
doi = {Xhttps:// doi.org/10.1016/j.mee.2018.09.008},
edition = {keiner},
author = {Lykova, M. and Langer, E. and Hinrichs, K. and Panschenko, I. and Meyer, J. and Künzelmann, U. and Wolf, M.J. and Lang, K.D.}
}